Teledyne Imaging (Waterloo, Ontario), a leader in imaging and machine-vision technology, will host six advanced sessions in an online event scheduled for November 17 – 19 to introduce its newest and most innovative imaging solutions. Online sessions led by subject-matter experts from across the Teledyne Imaging Group will cover topics such as machine learning and Artificial Intelligence (AI), extreme high-resolution and high-speed imaging, 3D sensing, non-visible and multi-spectral imaging, and high-volume/low-cost CMOS sensors.
Here’s the event agenda, with all times being Eastern Standard Times (EST):
Tuesday, November 17, 2020
- 9 am: Clarity at High Speed – Performance Imaging.
- 10:30 am: Connection is everything – Camera/Data Interfaces.
Wednesday, November 18, 2020
- 9 am: AI and Embedded Vision – Driving System Innovation.
- 10:30 am: New Advances in 3D Sensing.
Thursday, November 19, 2020
- 9 am: Beyond Sight! Non-Visible and Multi-Spectral Imaging.
- 10:30 am: Evolving CMOS Sensor Technology.
Please visit the Teledyne website to sign up for one or all of the sessions. Teledyne’s Digital Imaging business unit designs, develops and manufactures image-capture products, primarily high-performance image sensors and digital cameras for use in various applications. The company’s image-processing products primarily consist of hardware and software for image processing in industrial and medical applications.
Teledyne Imaging products include high-performance area and line-scan cameras, frame grabbers, vision software, X-ray detectors, infrared sensing and more.
